In the LNQE research building, there is a new facility for reactive ion etching (RIE) with inductively coupled plasma source for chlorine and fluorine. This system offers the possibility to etch metals and thus complements the already existing RIE. The RIE technology combines isotropic chemical etching and anisotropic physical etching (sputtering). The new system is a PlasmaPro 100 ICP65 from Oxford.
The new RIE comes through the group of Prof. Dr. Fei Ding (Institute of Solid State Physics) and can be used by the LNQE working groups. If you need it, please contact the LNQE technology.
